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Fiscal Wizard · Single-issue tearsheet

AMKR / Jun 21, 2026 Run #7384

AMKR

Amkor Technology, Inc.

Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, and the Asia Pacific. It offers turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, burn-in, system-level and final test, and drop shipment services; flip chip scale package products for smartphones, tablets, and other mobile consumer electronic devices; flip chip stacked chip scale packages that are used to stack memory digital baseband, and as applications processors in mobile devices; flip-chip ball grid array packages for various networking, storage, computing, automotive, and consumer applications; and memory products for system memory or platform data storage. The company provides wafer-level CSP packages for power management, transceivers, sensors, wireless charging, codecs, and specialty silicon; wafer-level fan-out packages used in power management, transceivers, radar, and specialty silicon; silicon wafer integrated fan-out technology that replaces a laminate substrate with a thinner structure; leadframe packages for electronic devices and mixed-signal applications; and substrate-based wirebond packages used to connect a die to a substrate. In addition, it offers micro-electro-mechanical systems packages that are miniaturized mechanical and electromechanical devices; and advanced system-in-package modules used in radio frequency and front end modules, basebands, connectivity, fingerprint sensors, display and touch screen drivers, sensors and MEMS, and NAND memory and solid-state drives. Further, the company provides wafer, package, and system level test services, as well as burn-in test and test development services. It serves integrated device manufacturers, fabless semiconductor companies, original equipment manufacturers, and contract foundries. Amkor Technology, Inc. was founded in 1968 and is headquartered in Tempe, Arizona.

Composite verdict

B 62.3 / 100
Bullish setup · Trend Following 13 drivers · 4 gates blocking
  • Rate of Change
  • Parabolic SAR Flip
  • Vortex Signal
Consider long call target Δ ~0.60 · ~35 DTE Bullish setup, Grade B → ITM call target

Industry rank 9th of 30 in Semiconductor Equipment & Materials

rescore-sweep
Technical synthesisRegime: volatile range
Bull 100%Evidence: High · 19 signals0% Bear
Momentum Bullish 99Mean-reversion Neutral 50

No notable composite patterns — the signals don't cluster into a named setup right now.

Where value comes fromMargin of safety -79%
Asset value $18.04Earnings power value $18.11Price $90.46

Priced above its no-growth earnings power value ($18.11/share) — you're paying for growth and franchise expansion, not just current earnings.

Fundamentals Weak

24.6 / 100

Score-bearing fundamentals shown here exclude gate-only risk checks. · 35 metrics shown.

Strongest
Weakest
Inventory Turnover 100
PEGY 0
Asset Turnover 80
PEG 0
Greenblatt EY 80
Margin of Safety 0

Technicals Bullish

100.0 / 100

Bullish setup leads (Rate of Change, Parabolic SAR Flip, Vortex Signal); bears gated by guards. · 43 signals shown.

Strongest
Weakest
Rate of Change 91
Parabolic SAR Flip 88
Vortex Signal 87

Risk Gates

4 blocking 4 caution

4 guards active, 21 signals gated.

ADX Trend Weakness Blocking

Weak trend strength blocks trend-following signals in either direction.

MA Crossover Blocking

Blocks counter-regime signals only when the MA crossover agrees with the long-term regime.

Realized Volatility Regime Blocking

High-vol regime mutes mean-reversion signals; low-vol regime mutes breakout signals.

Regime Filter Blocking

Blocks signals that oppose the long-term moving-average regime.

Breakdown

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Every chip in either subscore card drills into the metrics or signals that fed it — including the formula, the threshold band, and what the current reading means for AMKR.